Multichip Packages

Multichip Packages

选择 图像 零件编号 制造商1 描述 数据表 供货情况 单价(含13%增值税)根据您的数量,按照单价筛选表格中的结果。 数量 RoHS 电阻 容差 功率额定值 温度系数 外壳代码 - in 外壳代码 - mm
Product image Product name Manufacturer Explain Enquiries
WinbondW25M512JWCIQ 默认Thumbnail
454-W25M512JWCIQ Winbond Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector,
WinbondW25M512JVBIM TR 默认Thumbnail
454-W25M512JVBIMTR Winbond Multichip Packages spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR
WinbondW71NW11GE1EW 默认Thumbnail
454-W71NW11GE1EW Winbond Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x16/x16
WinbondW71NW11GC1DW 默认Thumbnail
454-W71NW11GC1DW Winbond Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x16
WinbondW71NW20GD3GW 默认Thumbnail
454-W71NW20GD3GW Winbond Multichip Packages 2G-bit 1.8V NAND + 1G-bit LPDDR1 MCP x8/x32
WinbondW25M512JWCIM TR 默认Thumbnail
454-W25M512JWCIMTR Winbond Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR
WinbondW71NW11GF1EW 默认Thumbnail
454-W71NW11GF1EW Winbond Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x16/x16
MicronMT29GZ6A6BPIET-53IT.112 TR 默认Thumbnail
340-415687-REEL Micron Multichip Packages MASSFLASH/LPDDR4 16G
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